赌船(首页)网址·(vip认证)-百度百科

      Auto Molding Sysetem is used for IC post-encapsulation process, in which the exposed ICs are molded with epoxy resin in high temperature and high pressure molds to meet the demand of reliability after chip encapsulation; the equipment is equipped with automatic loading, heating and constant temperature, mold closing, pressurization, injection, pressure-holding, mold opening, discharging, cleaning, gate removal and material collection.

1, The whole machine independent independent research and development, the mechanical part of the conventional models can be common on the imported equipment on the market product conversion parts and molds
2、Software control system operation is the same as imported models, providing a bilingual interface for staff to get started
3, The equipment is divided into conventional models, mainly for the market common IC batch packaging, custom models are for customer requirements, special manufacturing equipment, can meet the large tonnage, plus vacuum module, paste mold, etc.

Basically all package products on the market can be applied, such as TO、DIP、SOT、SOP、LSOP、TSOP、TSSOP、QFP、BGA、FBGA、PBGA、LGAQFN、DFN、 Micro-SD and so on.

设备参数：